Excellent Capabilities and Rich Experiences
Excellent Capabilities and Rich Experiences
Learn MoreStrong Industry Relationships
Strong Industry Relationships
Learn MoreAdvanced Design Capabilities
Advanced Design Capabilities
Learn MoreFlexible and Optimized Design Service Model
Flexible and Optimized Design Service Model
Learn MoreOur Core Competencies
Excellent Capabilities and Rich Experiences
VIA NEXT has assisted in more than 200 tape-out projects over the last 20 years, with applications in major technological fields such as computer hardware, communications, multimedia, AI, and IoT. Our extensive development experience and professional R&D team enable your company to choose the optimal processes and technology for your IC designs.
Client PC
Client PC
- TSMC 16nm FFC process
- CPU/chipset SoC, Octa-core @3.0GHz
- DDR4 memory interface
Cable Network STB
Cable Network STB
- TSMC 28nm FFC process
- SoC cable network set top box processor
- Quad-core CPU @1.8GHz
HPC
HPC
- TSMC 16nm FFC process
- CPU/chipset/AI processor SoC
- Octa-core CPU @2.5GHz
Mobile Phone AP
Mobile Phone AP
- TSMC 28nm FFC process
- Mobile application processor
- Quad-core CPU @1.4GHz
Our Core Competencies
Strong Industry Relationships
VIA NEXT has more than two decades of product development experience. We have long-term business and technical partnerships with the major players in the semiconductor industry, including IC foundries, as well as packaging, testing, and key component vendors, helping you to quickly obtain the advanced technology required to manufacture your IC designs..
Foundry
Packaging and Testing
Verification and Analysis
Foundry
Package & Testing
Verification and Analysis
Our Core Competencies
Advanced Design Capabilities
VIA NEXT boasts the industry’s most advanced design technology, software, and equipment. Customers can work directly with us to make use of the latest technological advancements in the IC industry, saving investment, manpower and resources.
EDA
Equipment
FPGA
EDA
Equipment
FPGA
Our Core Competencies
Flexible and Optimized Design Service Model
Control
- Technology Evaluation
- Manufacturing Management
- Yield Control & Improvement
- Advanced Package Design
- Power & Thermal Solution of IC and system
- Test Plan & Program
- System Level Test
- Yield & RMA Analysis
- Chip-Package-System & Software Development
- Chip and System Validation
- Reliability Analysis & Test
- Failure Analysis
Chain
Partners
- IC Manufacturing
- Package
- Testing
- ......
- Front-End IC Development
- Application Specific Know-how
- VIA NEXT
- Technology Evaluation
- Manufacturing Management
- Yield Control & Improvement
- Advanced Package Design
- Power & Thermal Solution of IC and system
- Test Plan & Program
- System Level Test
- Yield & RMA Analysis
- Chip-Package-System & Software Development
- Chip and System Validation
- Reliability Analysis & Test
- Failure Analysis
- Front-End IC Development
- Application Specific Know-how
- IC Manufacturing
- Package
- Testing
- ……
VIA NEXT’s business model is flexible and optimized to your needs. We provide bespoke services to achieve synergy with your own R&D capabilities and resources.
